Samsung starts mass production of automotive power inductors ...

Samsung Electro-Mechanics has started production of automotive power inductors for electric vehicle cameras in autonomous driving systems.

A car requires more than 100 power inductors, more than twice as many as a smartphone and this is expected to more than double by 2030 as the usage area expands to electric vehicles and autonomous driving.

The two 2016 inductors measure 2.0 mm long and 1.6 mm wide with capacities of 1.0 uH and 2.2 uH. The thin film products use thin coils formed on the package substrates, which has the advantage of higher productivity and miniaturization than the wire wound type where the coils are wound on magnetic substances.

Samsung Electro-Mechanics independently developed magnetic substances low losses based on the materials technology accumulated through MLCC ceramic capacitors and applied the photoresist technology used in semiconductor package substrates to precisely form coils with minute spacing.

The devices meet the AEC-Q200 automotive electronic component reliability test standard that requires a high level of reliability, allowing it to be used in other applications such as ADAS and in-vehicle and infotainment.

The power inductor market size is expected to reach approximately $3.65 billion by 2028, at a CAGR of approximately 9%. In particular, power inductors that can withstand high currents are required as the amount of current used continues to increase as the number of semiconductors installed inside vehicles increases and their performance improves due to the sophistication of automotive functions. The market for automotive power inductors is expected to show growth at a CAGR of about 12%.

“Power inductors are expected to experience high growth as the market for autonomous driving and electric vehicles expands,” said Chang Duckhyun, CEO of Samsung Electro-Mechanics. “Samsung Electro-Mechanics plans to develop power inductors into the ‘second MLCC’ based on our differentiated technology through the convergence of materials and package substrate technologies.”